| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To intend to enhance flexibility of mounting a cooling device in an electronic apparatus such as a laptop personal computer or the like, by enhancing flexibility of designing it and thinning its total thickness to 10 mm or less, or 5 mm or less. <P>SOLUTION: In this cooling device equipped with a liquid cooling means to diffuse heat from a heat generating component in the electronic apparatus by a coolant, and an air cooling means which is laminated on the liquid cooling means, and in which a group of air cooling fins to radiate heat diffused by the liquid cooling means are formed, this piezoelectric pump is to circulate the coolant, and is assembled in the liquid cooling means with a flat piezoelectric element used as a driving source, and is integrally connected with the liquid cooling means by using a metal material. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
