发明名称 MANUFACTURING METHOD OF SUBSTRATE WITH INSULATION FILM
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate with an insulation film capable of sufficiently covering the substrate with the insulation film and the substrate with the insulation film capable of sufficiently covering the insulation film with an upper layer. SOLUTION: The manufacturing method of the substrate with the insulation film includes the process of forming an adhesion layer by using a composition for forming the adhesion layer containing (A) and the process of forming the insulation film on the adhesion layer by using a composition for forming the insulation film containing (B): (A) a silane coupling agent and/or its condensate; and (B) a compound indicated by an expression (1) or a polymer obtained by polymerizing the compound. In this case, in the expression (1), Ar represents a radical having an aromatic ring, R<SP>1</SP>represents a radical indicated by an expression (2) or an expression (3), x represents an integer 1-3, y represents an integer 1-3, and x×y represents an integer 2-9. In the expression (2), Q<SP>1</SP>-Q<SP>3</SP>represent a hydrocarbon radical for which the number of hydrogen atoms or carbon atoms is 1-20. In the expression (3), Q<SP>4</SP>represents the hydrocarbon radical for which the number of the hydrogen atoms or carbon atoms is 1-20. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245458(A) 申请公布日期 2006.09.14
申请号 JP20050061958 申请日期 2005.03.07
申请人 SUMITOMO CHEMICAL CO LTD 发明人 SATO HISAYA;NEZU HIDEAKI
分类号 H01L21/312;C09D5/25;C09D7/12;C09D149/00;C09D183/04 主分类号 H01L21/312
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