| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a light-color semiconductor which has superior high-temperature standing characteristics and is environmentally superior, and to provide a semiconductor device that uses the same. SOLUTION: The epoxy resin composition for sealing the semiconductor contains epoxy resin, a curing agent, an inorganic filler, and a coloring agent as essential components; and contains Fe-Ti composite oxide as the coloring agent. Furthermore, in the semiconductor device, a semiconductor element is sealed with the epoxy resin composition for sealing the light-color semiconductor. COPYRIGHT: (C)2006,JPO&NCIPI
|
