| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting component which enables the increase of the number of connection terminals for electrical connection while restraining enlargement in size. SOLUTION: In a module substrate, a mount component such as a semiconductor component and an electronic component are packaged in upper and lower both sides, and the module substrate is mounted on a mother board in a mounting component. The mounting component has a module substrate 1 wherein a plurality of mount components such as a semiconductor component 4 and an electronic component 5, and a plurality of connection terminals 8 are packaged in a lower side; and a mother board 2 provided with a junction land 9 disposed in opposite direction to the connection terminal 8 in an upper side. In an assembly component A, the connection terminal 8 and the junction land 9 are electrically connected, and the module substrate 1 is mounted on an upper side of the mother board 2. An interference prevention hole 3 for avoiding interference to a mount component in a lower side of the module substrate 1 is formed in the mother board 2. COPYRIGHT: (C)2006,JPO&NCIPI
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