| 摘要 |
PROBLEM TO BE SOLVED: To provide a material excellent in a mechanical characteristic such as elongation and an electromagnetic shield performance with respect to high frequencies. SOLUTION: A metallic plating layer is formed on each side of a plating base layer provided on both sides of a resin film with many through-holes by a thickness of 0.5 to 20μm, the electric resistance between the front and rear sides is 40 mΩor below, and the tensile elongation is 1% or over. The plating base layer is mainly composed of Cu or Ni and formed by vacuum-deposition or sputtering. COPYRIGHT: (C)2006,JPO&NCIPI
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