| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive that has the relaxation property capable of corresponding to a flexible printed circuit board (FPC boad) and can form a hardened product superior in conductivity, adhesion, heat resistance, moisture resistance, flexibility and workability, when it is employed, in an IC, etc., for bonding a chip part, such as a semiconductor element, a chip resister and a chip LED, etc., to a leadframe or a heat sink. SOLUTION: This conductive adhesive comprises an electroconductive filler (A), a resin binder (B) and an organic solvent (C). The resin binder (B) comprises an epoxy resin (b1) as a main component and an epoxidized butadiene-styrene copolymer (b2). Preferably, the conductive filler (A) is a silver powder and the epoxidized butadiene-styrene copolymer (b2) is a thermoplastic resin with a specific structure. COPYRIGHT: (C)2006,JPO&NCIPI
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