| 摘要 |
To provide a circuit device having both of high heat releasing property and high breakdown voltage, and a method of manufacturing the same. A first insulating layer is formed on a front surface of a circuit board, and a second insulating layer is formed on a rear surface thereof. Conductive patterns are formed on a surface of the first insulating layer and are fixed to circuit elements. Furthermore, a metal board is stuck to a surface of the second insulating layer. A sealing resin covers front and side surfaces of the circuit board and additionally covers peripheral portions of the rear surface of the circuit board in a manner that the rear surface of the metal board is exposed. Thus, a heat releasing property and a withstand voltage property of the circuit board are ensured. |
