发明名称 BOTH-SIDED POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To polish a large work to be plane parallel without upsizing the device efficiently with high accuracy, to facilitate work setting operation, to secure the safety in operation, and further to heighten the adjusting range of polishing degree and the degree of freedom in polishing. <P>SOLUTION: This both-sided polishing device is adapted to polish both upper and lower sides of the work 6 held horizontally on a carrier 5 to be plane parallel by independently rotating upper level block 1 and lower level block 2. The device includes a rocking mechanism 7 for rocking the carrier 5 right and left. The rocking mechanism 7 is constructed by an arm-like frame 8 formed to hold the carrier 5 from the rear side by two arms, a longitudinal shaft 9 provided at the back of the arm-like frame 8 to serve as the center of rotation when the arm-like frame 8 is rocked right and left in the horizontal state, and a driving device 10 for rocking the arm-like frame 8 around the longitudinal shaft 9 right and left. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006239809(A) 申请公布日期 2006.09.14
申请号 JP20050058613 申请日期 2005.03.03
申请人 OTA KOGAKU KENKYUSHO:KK 发明人 WATANABE TETSUYA;WATANABE KAZUFUMI
分类号 B24B37/04;B24B37/08;B24B37/30;B24B47/16 主分类号 B24B37/04
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