FILLER FOR RESIN, RESIN BASE MATERIAL CONTAINING SAME AND ELECTRONIC COMPONENT SUBSTRATE MATERIAL

摘要

Disclosed is a technique which can be applied to a resin base material commonly used as substrate material and enables to improve the adhesion strength between the base material and a plated metal layer, namely a general resin base material improved in adhesion to a plated metal layer. Specifically disclosed is a filler for resins composed of a silica which is surface-treated with both a solution containing a silane coupling agent such as one obtained by a reaction between an azole compound or amine compound and an epoxysilane compound and a solution containing a noble metal compound, or alternatively surface-treated with a mixture of these solutions. Also specifically disclosed are a resin base material containing such a filler and an electronic component substrate material obtained by electroless plating such a resin base material.