| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating sheet(for electronic device/electronic part) with superior heat dissipation, electric insulation and mechanical strength and to provide its manufacturing method. SOLUTION: The heat dissipating sheet is composed of a metallic layer with high temperature conductivity and high electrical conductivity and a heat dissipating material layer having electrical insulation for covering one face or both faces thereof. The heat dissipating material layer has; [1] heat conductivity of 0.5 W/mK or more and lower than that of the metallic layer, [2] electric conductivity of 1×10<SP>-8</SP>Ω<SP>-1</SP>×m<SP>-1</SP>or less, and [3] one-face thickness of 10-200μm. At least one face of the metallic layer is coated with a composite for manufacturing the heat dissipating material layer and a solvent is dried and solidified to form a sheet. COPYRIGHT: (C)2006,JPO&NCIPI
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