| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin package exhibiting excellent heat dissipation which can be made thin and have multiple pins and easily manufactured, and to provide an optical device using it. SOLUTION: This resin package 5 comprises a metal base 12 on whose upper surface a die pad 1 is formed on which an optical semiconductor device 6 is mounted, a plurality of leads 2 arranged on the upper surface of the metal base 12 so that ends thereof opposing the short side of the die pad 1, and a resin seal 4 for sealing the upper surface of the metal base 12 so that the die pad 1 and the upper surface of both ends of the plurality of leads 2 are exposed. The innermost ends of inner leads 2a can be made thin, on the other hand a sufficient wiring pitch can be realized for outer leads 2b, so that this resin package can be made thin and have multiple pins to achieve excellent mounting characteristics. Further, because the die pad 1 is formed on the upper surface of the metal base 12, a good heat transmission rate can be achieved, and the metal base 12 can be disposed on the rear face side of the whole package, so that good heat dissipation characteristics can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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