发明名称 SUBSTRATE FOR PHOTOSENSITIVE BODY, MANUFACTURING METHOD OF SUBSTRATE FOR PHOTOSENSITIVE BODY AND PHOTOSENSITIVE BODY
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a substrate for a photosensitive body free to cut and work with no chattering and less total deflection, the substrate for the photosensitive body having high dimensional precision and the photosensitive body most suitable for an electronic photographing device free to have high resolution and to output full colors without causing a picture image defect. SOLUTION: Cutting work is carried out by adjusting a position of a cutting tool so that an angleθat which a line connecting a center of of a cylinder body from a point where a head end of a knife edge of the cutting tool makes contact with the aluminum alloy made cylinder body and a front flank of the cutting tool cross with each other comes to be in a range smaller by 0.78 to 0.18 degrees than (90+A) degrees by making the front flank of the cutting tool A degrees by using the cutting tool the front flank of which is 3 to 15 degrees in a state where packing to pressurize an inner surface of the cylinder body is inserted into the inside of the aluminum alloy made cylinder body under this manufacturing method of the substrate for the photosensitive body. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006239850(A) 申请公布日期 2006.09.14
申请号 JP20050062631 申请日期 2005.03.07
申请人 RICOH CO LTD 发明人 YAMAZAKI JUNICHI
分类号 B23B5/00;G03G5/00;G03G5/10 主分类号 B23B5/00
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