发明名称 |
Printed Wiring Board and Method for Manufacturing The Same |
摘要 |
In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon another. The first conductive layer ( 11 ) is constituted as a parts connecting layer and the n-th conductive layer ( 13 ) is constituted as an external connecting layer which is connected to external connecting terminals ( 7 ). The second to (n- 1 )-th conductive layers ( 12 ) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer ( 13 ) is coated with the outermost n-th insulating layer ( 23 ) in a state where the external connecting terminals ( 7 ) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.
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申请公布号 |
US2006202344(A1) |
申请公布日期 |
2006.09.14 |
申请号 |
US20060420421 |
申请日期 |
2006.05.25 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TAKADA MASARU;MINOURA HISASHI;TSUKADA KIYOTAKA;KOBAYASHI HIROYUKI;KONDO MITSUHIRO |
分类号 |
H01L23/52;H05K3/00;H01L23/12;H01L23/498;H01L23/50;H05K1/11;H05K3/28;H05K3/34;H05K3/38;H05K3/46 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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