发明名称 Printed Wiring Board and Method for Manufacturing The Same
摘要 In a printed wiring board, an odd number (n) of conductive layers ( 11 - 13 ) and insulating layers ( 21 - 23 ) are alternately laminated upon another. The first conductive layer ( 11 ) is constituted as a parts connecting layer and the n-th conductive layer ( 13 ) is constituted as an external connecting layer which is connected to external connecting terminals ( 7 ). The second to (n- 1 )-th conductive layers ( 12 ) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer ( 13 ) is coated with the outermost n-th insulating layer ( 23 ) in a state where the external connecting terminals ( 7 ) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.
申请公布号 US2006202344(A1) 申请公布日期 2006.09.14
申请号 US20060420421 申请日期 2006.05.25
申请人 IBIDEN CO., LTD. 发明人 TAKADA MASARU;MINOURA HISASHI;TSUKADA KIYOTAKA;KOBAYASHI HIROYUKI;KONDO MITSUHIRO
分类号 H01L23/52;H05K3/00;H01L23/12;H01L23/498;H01L23/50;H05K1/11;H05K3/28;H05K3/34;H05K3/38;H05K3/46 主分类号 H01L23/52
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