| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of being mounted easily and surely on an external substrate and the like through soldering. <P>SOLUTION: A semiconductor device is provided with a first lead portion 21 with a large width, second lead portion 22 with narrow width, third lead portion 23, which is inserted into an external substrate, and gap control portion 9, which keeps a gap constant between the semiconductor device and the external substrate. The method for manufacturing the semiconductor device is configured, in such a way that the lead is formed by linearly cutting a lead frame having a broad portion corresponding to the first lead portion 21, narrow portion corresponding to the third lead portion 23, and tie bar portion 11, which couples the broad portion and narrow portion, and in which two notch portions 31 are formed in the region on the side of the narrow portion. Furthermore, both notch portions 31 are made to be located on both sides of the range of the narrow portion in terms of the lead width direction, located on the extension of both sides of the broad portion and is provided with the gap control means 9, in advance. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
