| 摘要 |
PROBLEM TO BE SOLVED: To efficiently form a high-quality metal film (protection film), especially on the surface of wiring etc. without deteriorating the electric property of the wiring by subjecting a substrate to an activation treatment such as catalyst-imparting treatment using an optimized processing liquid. SOLUTION: The metal film is formed on the surface of the substrate by contacting the surface of the substrate, preferably cooled to a prescribed temperature of≤15°C, to the processing liquid whose temperature is adjusted to≤15°C to activate the surface, and then contacting the activated surface of the substrate to a plating solution. COPYRIGHT: (C)2006,JPO&NCIPI
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