| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated gas control device which is highly integrated with piping equipment to be mounted thereon, for improving the foot-print performance of a whole manufacturing device, when mounted on the manufacturing device such as a semiconductor manufacturing device by miniaturizing a control device body, and to provide its method. SOLUTION: A plurality of opening portions 14 are formed in surface and reverse 13a, 13b of a flow path plate 13 having a gas flow path 12, in communication with the flow path. The opening portions 14 are arranged in zigzag along the surface and reverse 13a, 13b of the flow path plate 13. The piping equipment 100 is arranged in each of the opening portions 14 to hold the surface and reverse 13a, 13b of the flow path plate 13. COPYRIGHT: (C)2006,JPO&NCIPI
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