| 摘要 |
The present invention provides a semiconductor module having: a semiconductor device (10) having a contact device (11) for making electrical contact with a connection device (17; 20) via a rewiring device (15, 15', 15''); and a carrier device (12, 13, 14) for mechanically coupling the semiconductor device (10) to a connection device (17), the carrier device (12, 13, 14) having a gradient between a first modulus of elasticity at the semiconductor device (10) and a second, higher modulus of elasticity at the connection device (17; 20). The present invention likewise provides a method for producing a semiconductor module. |
