| 摘要 |
<p>A mold release film that excels in high-temperature flexibility, unevenness follow-up property, thermal stability, mold release capability and non-staining property and after service, can be easily disposed of. In particular, a mold release film for use in the production of printed wiring boards, flexible printed wiring boards and multi-layer printed wiring boards, which has at least one major surface thereof provided with a layer of resin composition comprising a resin having polar groups on its main chain as a matrix wherein halogen is contained at a ratio of 5 wt.% or less.</p> |
