| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus for processing a substrate capable of accurately control a reflow distance L within a desired value. SOLUTION: The gas for exposure processing introduced in a chamber 101 is blown to a substrate 1 through openings 211 formed in a gas blowing plate 21. Since the gas 33 for exposure processing is uniformly blown to the substrate 1 by the gas blowing plate 21 under the pressure condition, a reflow distance may be controlled accurately over the entire surface of the substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI |
