| 摘要 |
PROBLEM TO BE SOLVED: To restrict ageing while keeping low cost and a small body of an imaging device on which each solid state imaging element is mounted, with respect to the solid state imaging element with a structure in which each photoelectric conversion film is laminated above a semiconductor substrate. SOLUTION: In the solid state imaging element, a plurality of pixel units including three photoelectric conversion films laminated on a semiconductor substrate are arranged on the semiconductor substrate. Three photoelectric conversion films included in one pixel are arranged between each pixel electrode film 14, 18, and 22 and each counter-electrode film, respectively, and this region between these films functions as a pixel region for generating signal charge for forming one pixel data. The pixel region has a shape having a projection a and a convex b in a plane view, and part of the projection a may breaks into the convex b in the pixel region of an adjoining pixel unit in this arrangement. COPYRIGHT: (C)2006,JPO&NCIPI
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