COPPER BONDING OR SUPERFINE WIRE WITH IMPROVED BONDING AND CORROSION PROPERTIES

摘要

The invention relates to a bonding or superfine wire made from copper, with a gold enrichment on the surface thereof, in particular to an amount corresponding to a coating of at most 50 nm, or which may be bonded by the ball/wedge method, has a copper-coloured appearance and the ball thereof after flame-off has a hardness of 95 by HVO.002. In order to produce said bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. Said wires are bonded to a semiconductor silicon chip.