发明名称 |
METHOD FOR PRODUCING POWDER ELECTROLESS-PLATED WITH ELECTROCONDUCTIVE SUBSTANCE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a powder electroless-plated with an electroconductive substance having many microspikes, without using chromic acid or permanganic acid causing environmental pollution. SOLUTION: The method for producing the powder electroless-plated with the electroconductive substance comprises the steps of: illuminating a suspension containing a core powder and a semiconductor particle suspended in a liquid with light; thereby hydrophilizing the surface of the powder and simultaneously depositing the semiconductor particle onto the surface of the powder; and then forming a metallic film on the surface of the powder, which has been hydrophilized and has the semiconductor particle deposited thereon, with an electroless plating technique. The employed core powder and semiconductor particle have such a particle diameter ratio (former/latter) as to satisfy 10 to 10<SP>5</SP>. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006241499(A) |
申请公布日期 |
2006.09.14 |
申请号 |
JP20050056816 |
申请日期 |
2005.03.02 |
申请人 |
NIPPON CHEM IND CO LTD;KANTO GAKUIN UNIV SURFACE ENGINEERING RESEARCH INSTITUTE |
发明人 |
HONMA HIDEO;TASHIRO KATSUHIKO;ABE SHINJI;OYAMADA MASAAKI;INABA HIROYUKI |
分类号 |
C23C18/31;C23C18/20;H01B5/00;H01B13/00 |
主分类号 |
C23C18/31 |
代理机构 |
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