发明名称 INITIAL MAKE-UP METHOD FOR PLATING LIQUID AND COPPER PLATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for performing the initial make-up of organic additives with unknown concentration in a plating liquid at high precision by a CVS (cyclic voltammetry stripping) process. SOLUTION: In the initial make-up method by a CVS process, using a standard liquid including the respective optimum values of a plurality of organic additives to be added to a plating liquid as known concentration, the analysis of the standard liquid is performed at the prestage and the postage in the analysis of the plating liquid with unknown concentration, a correction factor is calculated from the analysis value in the prestage, the analysis value in the poststage is corrected, and the feed of the organic additives to be fed to the plating liquid with unknown concentration is controlled. The correction factor is [the known concentration of the standard liquid/the analysis value in the prestage], and, in the plating device 100, a plating tank 1 is fitted with an analyzer 2 by a CVS process, and, based on the analysis value in each organic additive, a treatment apparatus 4 commands an organic additive replenishment apparatus 3 to perform automatic replenishment. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006241566(A) 申请公布日期 2006.09.14
申请号 JP20050061919 申请日期 2005.03.07
申请人 FUJITSU LTD 发明人 MIYAHARA SHOICHI;KARASAWA KAZUAKI;FUKUDA HIROYUKI
分类号 C25D13/22 主分类号 C25D13/22
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