COMPOSITION HAVING METAL PARTICLES DISPERSED THEREIN, AND METHOD FOR FLIP CHIP MOUNTING AND METHOD FOR FORMING BUMP USING THE SAME

摘要

Provided is a resin composition having metal particles dispersed therein which is suitably used in a method for the flip chip mounting or a method for forming a bump. The above composition comprises a first component (3a), a second component (3b), metal particles (1), (1') and a convection additive. In the second component (3b), metal particles (1), (1') are dispersed and also a convection additive is contained. At least a part of metal particles (1) has the first component (3a) being built therein, and when metal particles (1) are molten resulting from heating, the first component (3a) is contacted with the second component (3b) to start the formation of a thermosetting resin (3c). The convection additive generates a gas as a result of the heating and causes the convection in the inside of the composition.