发明名称 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
摘要 A chemical mechanical polishing aqueous dispersion, including: (A) abrasives; (B) an organic acid; (C) benzotriazole or a benzotriazole derivative; (D) a poly(meth)acrylate; (E) an oxidizing agent; and (F) water, the abrasives (A) being included in the chemical mechanical polishing aqueous dispersion in an amount of 2 to 10 wt %.
申请公布号 US2006201914(A1) 申请公布日期 2006.09.14
申请号 US20060369870 申请日期 2006.03.08
申请人 JSR CORPORATION 发明人 UCHIKURA KAZUHITO;HATTORI MASAYUKI;KAWAHASHI NOBUO
分类号 C09K13/00;B44C1/22;C03C15/00 主分类号 C09K13/00
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