发明名称 |
Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion |
摘要 |
A chemical mechanical polishing aqueous dispersion, including: (A) abrasives; (B) an organic acid; (C) benzotriazole or a benzotriazole derivative; (D) a poly(meth)acrylate; (E) an oxidizing agent; and (F) water, the abrasives (A) being included in the chemical mechanical polishing aqueous dispersion in an amount of 2 to 10 wt %.
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申请公布号 |
US2006201914(A1) |
申请公布日期 |
2006.09.14 |
申请号 |
US20060369870 |
申请日期 |
2006.03.08 |
申请人 |
JSR CORPORATION |
发明人 |
UCHIKURA KAZUHITO;HATTORI MASAYUKI;KAWAHASHI NOBUO |
分类号 |
C09K13/00;B44C1/22;C03C15/00 |
主分类号 |
C09K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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