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发明名称
BONDING PAD HAVING GROVES AND METHOD OF FABRICATING THE SAME
摘要
申请公布号
KR20060097442(A)
申请公布日期
2006.09.14
申请号
KR20050019780
申请日期
2005.03.09
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
MOON, IL YOUNG;CHO, YOUNG SEUNG;LEE, KWEON JAE;HAN, SUNG HEE;SONG, BO YOUNG
分类号
H01L21/60
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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