| 摘要 |
PROBLEM TO BE SOLVED: To provide a steam barrier film difficult to allow the adhesion of dust or the like and having high gas barrier properties. SOLUTION: The steam barrier film is constituted by providing at least two inorganic gas barrier layers and at least one conductive layer with a resistivity of 10<SP>12</SP>Ω(at 25°C, relative humidity: 60%) on a base material film. Each of the inorganic gas barrier layers contains an oxide, nitride or oxynitride of at least one metal selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce and Ta. The conductive layer contains at least one kind of a conductive inorganic metal material and/or at least one kind of an organic conductive material. The base material film is preferably a polyester film with a Tg of 150°C or above or preferably contains a resin having a spiro structure or a cardo structure. This steam barrier film can be suitably used as the substrate of a device of every kind or the coating film of a device. COPYRIGHT: (C)2006,JPO&NCIPI
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