发明名称 Method for contacting circuit board conductors of a printed circuit board
摘要 A method for electrically connecting first and second circuit board conductors of a printed circuit board, wherein the first and second circuit board conductors being disposed in different planes of the circuit board and separated by an insulator layer, includes the step of placing a cover onto at least one of the first and second circuit board conductors and making a cutout through the cover, the insulator layer and the first and second circuit board conductors. In addition, an electrically conductive layer is applied under mechanical load onto the cover at least in the area of the cutout so that an electric connection is created along an inner wall surface of the cutout between the first and second circuit board conductors via the electrically conductive layer.
申请公布号 US2006204652(A1) 申请公布日期 2006.09.14
申请号 US20060371823 申请日期 2006.03.09
申请人 LPKF LASER & ELECTRONICS AG 发明人 MEIER DIETER
分类号 B05D5/12 主分类号 B05D5/12
代理机构 代理人
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