| 摘要 |
A wafer-processing tape ( 10 ), having an intermediate resin layer ( 2 ), a removable adhesive layer ( 3 ), and, if necessary, an adhesive layer ( 4 ), which are laminated in this order on a substrate film ( 1 ), wherein a storage elastic modulus at 80° C. of the intermediate resin layer is larger than a storage elastic modulus at 80° C. of the removable adhesive layer. |
