| 摘要 |
PROBLEM TO BE SOLVED: To provide a board accommodating case with less size error capable of suitably accommodating and storing a less number of boards, improving efficiency and economy, and easily realizing manufacture or the like using metal dies. SOLUTION: The board accommodating case comprises a case body 1 for accommodating a couple of semiconductor wafers and a cover body for opening and closing the aperture of the case body 1. The front view of the case body 1 is formed like a rectangular front-open box and a ratio of the longer side and the shorter side of the aperture of the front view is set within the range of 1.6 to 25. The ceiling 3, a rear surface wall and both side walls 10 which are greater part of the case body 1 are integrally molded and the remainder is formed as a separated bottom plate 25. After these are molded, these are integrated through the repeated molding process. Since the greater part of the case body 1 and the bottom plate 25 are individually molded and these are molded again after these are assembled, if the aperture of the case body 1 is narrow and depth becomes longer, the case body 1 can be separated from the metal die in the molding process without difficulty. COPYRIGHT: (C)2006,JPO&NCIPI |
