| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating circuit board that can have the high junction reliability between respective components of a board, and to provide a power module. SOLUTION: There are an insulator plate 11, a circuit layer 12 joined onto one surface of the insulator plate 11, and a radiator 16 joined onto the other surface of the insulator plate 11. An electrical heating element 30 is joined onto the surface of the circuit layer 12. The insulator plate 11 is formed by a glass material, and one or at least two kinds of insulating high temperature conductive hard particle are mixed inside. The circuit layer 12 is formed by pure Al or an Al alloy. In the radiator 16, a Young's modulus in a longitudinal direction is 120,000 MPa or higher and 400,000 MPa or smaller, thermal conductivity is 50 W/mK or higher and 200 W/mK or smaller, and a thermal coefficient of expansion is 2×10<SP>-6</SP>/°C or higher and 10×10<SP>-6</SP>/°C or smaller. In at least one kind of insulating high temperature conductive hard particle, both the edges project toward the circuit layer 12 and the radiator 16. COPYRIGHT: (C)2006,JPO&NCIPI |
