发明名称 HEAT-TREATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat-treating apparatus that can heat and cool a substrate while the substrate is being conveyed, has high throughput, and can suppress irregularities when heating and cooling the substrate. SOLUTION: A post bake zone (POB) 56 that is an example of the heat-treating apparatus comprises a substrate conveyance mechanism 71 for conveying the substrate G horizontally; and a plurality of panel-shaped heaters 72 arranged at a prescribed height position on a conveyance route of the substrate G by the substrate conveyance mechanism 71, while a gap 73 is provided at a prescribed interval along the conveyance route for heating the substrate G. The heater 72 comprises a plurality of small heaters 72a, 72b. The plurality of small heaters 72a, 72b are connected so that the joint is not in parallel with a substrate conveyance direction within a fixed distance range to prevent a transfer mark from occurring on the substrate G due to the joint of the plurality of small heaters 72a, 72b. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006245110(A) 申请公布日期 2006.09.14
申请号 JP20050055944 申请日期 2005.03.01
申请人 TOKYO ELECTRON LTD 发明人 OTA YOSHIHARU
分类号 H01L21/027 主分类号 H01L21/027
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