EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation having good laser-marking properties and giving a molded product hard to be discolored. SOLUTION: This epoxy resin composition for semiconductor encapsulation comprises an epoxy resin and curing agents, where the curing agents expressed by formula 1 and formula 2 are used in combination, and 0.05 mass% or less carbon black is added to the total amount of the epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI