发明名称 COOLING STRUCTURE OF ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic device capable of sufficiently cooling an electronic device mounted to an engine room with a small number of parts and a simple structure. SOLUTION: In this cooling structure of an electronic device, a box 3 with one end opened accommodating an electronic device 1 penetrates through a partition wall 5 dividing an engine room 3 and an occupant cabin 4, and an opened end 3b of the box 2 is positioned in the occupant cabin 4. A space between the box 2 and the partition wall 5 is sealed. When a part of the electronic device 1 is exposed from the box 2, cool air of the crew cabin 4 contacts the electronic device 1 to improve cooling efficiency. When the box 2 is formed of a heat-insulating material, thermal influences in the engine room 2 are reduced to improve cooling efficiency. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006240340(A) 申请公布日期 2006.09.14
申请号 JP20050055404 申请日期 2005.03.01
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 KOYATA KEN
分类号 B60R16/02 主分类号 B60R16/02
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