摘要 |
A printed circuit board component includes a housing carrying a peg that engages a printed circuit board hole. This peg has a radially projecting detent lug extending beyond the plug outer periphery. The lug is located and formed on the peg so the peg outer periphery is smaller in the area of the lug than the diameter of the hole. The outer periphery of the section of the peg projecting into the hole is such that, between the outer periphery of this section and the hole inner wall, a space having a capillarity for solder is formed over a portion of the outer periphery. During soldering, solder on the printed circuit board surface enters and fills the space by capillary action.
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