HEAT ABSORPTION MEMBER, COOLING DEVICE, AND ELECTRONIC APPARATUS

摘要

Electronic parts (CPU element (2a), capacitor (2b), coil element (2c)) having different heights are mounted on a printed circuit board (1). A heat absorption member (3) is provided above the printed circuit board (1) such that the heat absorption member (3) is in contact with the upper surface of the CPU element (2a), which is the lowest of the three, and in contact with side surfaces of the capacitor (2b) and the coil element (2c). The heat absorption member (3) has a flow path (4) for circulating a cooling medium. Heat produced by the CPU element (2a) is transmitted from its upper surface to the cooling medium in the flow path (4) via the heat absorption member (3), and heat produced by the capacitor (2b) and the coil element (2c) is transmitted from their side surfaces to the cooling medium in the flow path (4) via the heat absorption member (3).