发明名称 |
HOT MELT ADHESIVE COMPOSITION |
摘要 |
<p>[Problem] To provide an adhesive composition which is used for fixing a semiconductor wafer or the like onto a substrate, exhibits firm adhesion with high heat resistance in the wafer grinding stage and is melted by heating to enable easy peeling after the completion of the wafer grinding stage. [Means to solve problem] The hot-melt adhesive composition of the invention is a composition containing as a main component a crystalline compound having a melting temperature of 50 to 300°C, and has a melting temperature width of not more than 30°C and a melt viscosity of not more than 0.1 Pa·s. The crystalline compound as a main component is desired to be an organic compound composed of elements of C, H and O only and having a molecular weight of not more than 1000, preferably an aliphatic compound or an alicyclic compound, particularly preferably a compound having a steroid skeleton and/or a hydroxyl group.</p> |
申请公布号 |
EP1700896(A1) |
申请公布日期 |
2006.09.13 |
申请号 |
EP20040819383 |
申请日期 |
2004.11.25 |
申请人 |
JSR CORPORATION |
发明人 |
YASUDA, KYOUYU,;ITOU, NOBUYUKI,;YOKOYAMA, YASUAKI |
分类号 |
C09J11/06;C09J201/00;H01L21/68 |
主分类号 |
C09J11/06 |
代理机构 |
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代理人 |
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