发明名称
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module mounting device as well as a method for controlling its temperature, capable of individually controlling temperature of a plurality of electronic parts, with a small mounting area and less assembling processes. SOLUTION: Related to the thermoelectric module mounting device, a plurality of thin-film heaters 2 of temperature adjusting members, and a thermistor 3 which detects the temperature of a bulk-type thermoelectric module 1 are formed on the bulk-type thermoelectric module 1. A base substrate 4 of Cu-W is formed on the thin-type heater 2 through an insulator, and a thermistor 5 and an LD 6 are formed on the base substrate 4. The thin-film heaters 2 are formed by pasting a nichrome sheet to the bulk-type thermoelectric module 1, or the like with two gold wires 8 connected to each thin-film heater 2. After controlling electrification to the bulk-type thermoelectric module 1 based on the result of temperature detection of the thermistor 3, the thin-film heater 2 is controlled for electrification based on the result of temperature detection of the thermistor 5.
申请公布号 JP3820942(B2) 申请公布日期 2006.09.13
申请号 JP20010262267 申请日期 2001.08.30
申请人 发明人
分类号 H01L23/38;H05B3/00;G05D23/24;H01L23/34;H01L35/16;H01L35/28;H01L35/32;H01S5/024 主分类号 H01L23/38
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