| 摘要 |
1,071,429. Semi-conductor device. SIEMENS-SCHUCKERTWERKE A.G. Oct. 30, 1964 [Oct. 31, 1963], No. 44447/64. Heading H1K. A semi-conductor device comprising a body of semi-conductor material, a housing enclosing the body in gas-tight fashion, a layer of solder fixing a surface of the semi-conductor to a part of the housing and a stressed resilient means maintaining a pressure of 0.2 to 2 Kg/mm.<SP>2</SP> between the layer of solder and the semi-conductor. A copper housing 1 having fins 2 has an annulus of steel 4 soldered 7 to its upper part. A semiconductor body 8 having doped zones and being coated with N: and Pb is mounted in the housing I with solder 9. Above the body 8 is another solder layer 10 upon which is mounted a silver-plated copper body 11 having a flange 12a and connector part 12. A ceramic insulating annulus 13 lies above the body 11 and is pressed down thereon by an arched saddle spring 14 above which is a steel retaining ring 15 having an insulating glass bushing 16 at its centre. A gas tight fit is achieved using an ironnickel sleeve 17 and a solder ring 18 whilst the ring 15 may be welded to annulus 4. The fins 2 on the body 1 enable the body to bite into the bore of a framework or other body upon which it is mounted. |
