发明名称 |
Surface acoustic wave device and manufacturing method of the same |
摘要 |
A surface acoustic wave device has a SAW device element 10 and a package 20 housing the SAW device element. The package includes a resin substrate 20 having metal patterns 21 and 22 formed on both surfaces thereof, and a resin cap 32. The SAW device element is mounted on one of the metal patterns of the resin substrate. The resin cap is adhered to the resin substrate to cover the SAW device element. The surfaces of the resin substrate are flush with corresponding end surfaces of the resin cap. |
申请公布号 |
EP1630955(A3) |
申请公布日期 |
2006.09.13 |
申请号 |
EP20050255309 |
申请日期 |
2005.08.30 |
申请人 |
FUJITSU MEDIA DEVICES LIMITED |
发明人 |
MISHIMA, NAOYUKI;KOORIIKE, TAKUMI |
分类号 |
H03H9/10;H03H3/08 |
主分类号 |
H03H9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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