| 摘要 |
PURPOSE: Provided is an anisotropic conductive film for use as connective materials in LCD packaging which does not give damage on short or circuit pattern even if IC of fine pitch or bump is connected. CONSTITUTION: The anisotropic conductive film is characterized that conductive particles and thermoplastic insulated resin particles are dispersed in an insulated adhesive based on resin components bearing epoxy group and resin components to aid formation of film. The conductive particles are inorganic or organic particles coated with metal, or metal particles having 1 to 10 micrometer of mean particle diameter, and are modified by pressure. The insulated resin particles are thermoplastic resin particles a high melting point of 150 to 200 deg.C with or thermoplastic resin particles with a low melting point of 80 to 150 deg.C, which are used independently or as a mixture thereof. |
