Ceramic circuit board

摘要

A ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to said ceramic substrate through a brazing material layer;
wherein said ceramic substrate is composed of a silicon nitride (Si 3 N 4 ) substrate having a thermal conductivity of 50W/mK or more and said metal circuit plate is composed of an aluminium circuit plate; and
wherein said silicon nitride substrate and said aluminium circuit plate are directly bonded without providing a brazing material layer.