发明名称 HIGH TEMPERATURE CIRCUITS
摘要 Methods and systems for operating integrated circuits at temperatures higher than expected ambient temperatures. The heating may be of entire circuit boards, portions of the circuit boards (such as the components within a multiple-chip module) and/or single devices. Methods and related systems may be used in any high temperature environment such as downhole logging tools, and the devices so heated are preferably of silicon on insulator semiconductor technology.
申请公布号 EP1700003(A2) 申请公布日期 2006.09.13
申请号 EP20040794910 申请日期 2004.10.13
申请人 HALLIBURTON ENERGY SERVICES, INC. 发明人 RODNEY, PAUL, F.;MASINO, JAMES, E.;SCHULTZ, ROGER, L.
分类号 E21B47/01;E21B36/00;E21B43/24;E21B49/00;H01L23/34;H05K;H05K1/02 主分类号 E21B47/01
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