发明名称 |
Substrate treating method and apparatus |
摘要 |
A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.
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申请公布号 |
US7105074(B2) |
申请公布日期 |
2006.09.12 |
申请号 |
US20020202279 |
申请日期 |
2002.07.22 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
TAMADA OSAMU;MITSUHASHI TSUYOSHI;MATSUNAGA MINOBU;YOSHIOKA KATSUSHI;SUGIMOTO KENJI;AOKI KAORU;YANO MORITAKA;YAMAMOTO SATOSHI;SANADA MASAKAZU;NAGAO TAKASHI;KODAMA MITSUMASA |
分类号 |
B05B3/00;H01L21/027;B08B3/00;H01L21/00;H01L21/311 |
主分类号 |
B05B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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