发明名称 Semiconductor device and method of fabricating the same
摘要 A semiconductor device includes a semiconductor substrate which has a major surface and a MOS transistor which has a gate and first and second diffusion regions and which is formed on the major surface. The semiconductor device also includes a laminated structure of a SOG layer, wherein the laminated structure is composed of a base layer and a surface layer formed on the base layer and is formed over the MOS transistor and wherein the surface layer is denser than the base layer.
申请公布号 US7105464(B2) 申请公布日期 2006.09.12
申请号 US20040862331 申请日期 2004.06.08
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 ASAKAWA KAZUHIKO;SHIMIZU WATARU
分类号 H01L21/4763;H01L21/324;H01L21/44;H01L21/469;H01L21/60;H01L21/768;H01L23/525;H01L29/06 主分类号 H01L21/4763
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