| 摘要 |
A semiconductor device and a fabrication method thereof are provided. The semiconductor device has a probing pad formed on a chip. The probing pad is connected to an output pad and an internal circuit though a fuse. After an electrical testing of the chip by the probing pad, the fuse is cut by a laser beam. Therefore, the probing pad is disconnected from the output pad and the internal circuit. The output pad is connected to an output lead of a package, which is encapsulating the chip. According to the device and the fabrication methods thereof, performance of the device can be enhanced by a low parasitic capacitance and a low parasitic resistance.
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