| 发明名称 |
Semiconductor integrated circuit device and manufacturing method of the same |
| 摘要 |
To provide a semiconductor device which can be down-sized and integrated to a high degree. A semiconductor device including a rewiring mixedly includes an input/output (I/O) cell connected to a probing pad; and another input/output (I/O) cell having no probing pad.
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| 申请公布号 |
US7105933(B2) |
申请公布日期 |
2006.09.12 |
| 申请号 |
US20040809796 |
申请日期 |
2004.03.26 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HAZA AKINORI;OKADA YASUYUKI;NOBATA MASUMI |
| 分类号 |
H01L21/66;H01L23/48;H01L21/3205;H01L21/82;H01L21/822;H01L21/8242;H01L23/31;H01L23/485;H01L23/52;H01L23/525;H01L23/58;H01L27/04;H01L27/108;H01L29/40 |
主分类号 |
H01L21/66 |
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