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发明名称
Method for manufacturing package substrate using a electroless Ni plating
摘要
申请公布号
KR100619348(B1)
申请公布日期
2006.09.12
申请号
KR20040075512
申请日期
2004.09.21
申请人
发明人
分类号
H05K3/06;H05K3/46
主分类号
H05K3/06
代理机构
代理人
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