发明名称 |
Resin aqueous dispersion composition |
摘要 |
The present invention provides a resin aqueous dispersion composition comprising water and at least one kind of resin particle, wherein when a primary average particle of each resin particle is taken as a sphere of the same volume, a nonionic surfactant is present in the composition in an amount which occupies 75 to 95% of a theoretical void among resin particles of 26% when each resin particle is arranged in a close packed structure. The nonionic surfactant is a solvent which is substantially nonvolatile in a temperature range of up to 100° C. and evaporates or thermally decomposes at a temperature lower than the thermal decomposition temperature of the resin particles. The resin aqueous dispersion composition can be coated thickly and can prevent development of mud crack.
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申请公布号 |
US7105597(B2) |
申请公布日期 |
2006.09.12 |
申请号 |
US20040485152 |
申请日期 |
2004.01.29 |
申请人 |
DAIKIN INDUSTRIES, LTD. |
发明人 |
SODA YOSHIHIRO;TOMIHASHI NOBUYUKI;MOMOSE HIROMICHI;OGITA KOICHIRO |
分类号 |
C08L1/00;C08L101/00;C08K3/00;C08K5/06;C08L27/18;C08L33/08;C08L71/02 |
主分类号 |
C08L1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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