发明名称 Resin aqueous dispersion composition
摘要 The present invention provides a resin aqueous dispersion composition comprising water and at least one kind of resin particle, wherein when a primary average particle of each resin particle is taken as a sphere of the same volume, a nonionic surfactant is present in the composition in an amount which occupies 75 to 95% of a theoretical void among resin particles of 26% when each resin particle is arranged in a close packed structure. The nonionic surfactant is a solvent which is substantially nonvolatile in a temperature range of up to 100° C. and evaporates or thermally decomposes at a temperature lower than the thermal decomposition temperature of the resin particles. The resin aqueous dispersion composition can be coated thickly and can prevent development of mud crack.
申请公布号 US7105597(B2) 申请公布日期 2006.09.12
申请号 US20040485152 申请日期 2004.01.29
申请人 DAIKIN INDUSTRIES, LTD. 发明人 SODA YOSHIHIRO;TOMIHASHI NOBUYUKI;MOMOSE HIROMICHI;OGITA KOICHIRO
分类号 C08L1/00;C08L101/00;C08K3/00;C08K5/06;C08L27/18;C08L33/08;C08L71/02 主分类号 C08L1/00
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