| 摘要 |
A device characteristic testing system for testing a first DUT (device under test), a second DUT, a third DUT and a fourth DUT on a wafer, each of the DUTs includes a first end and a second end, the device characteristic testing system includes: a device characteristic testing circuit formed on the wafer includes a first conducting line connected to the second end of the first and the fourth DUT, a second conducting line connected to the second end of the second and third DUTs, a third conducting line connected to the first end of the first and second DUTs, a fourth conducting line connected to the first end of the third and fourth DUT, and a plurality of testing pads respectively coupled to the first, second, third, and fourth conducting line for receiving at least one testing signal to detect device characteristics of the DUTs.
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